Continuous tracking of the operating constraints shaping AI infrastructure.
Two connected layers inside one system-level research framework.
Bandwidth density and data movement are becoming system-level constraints as AI clusters scale.
The optical transition remains intact, while CPO timing and deployment readiness remain the key evidence gap.
HBM growth can redirect scarce wafer, packaging and testing resources across the broader memory stack.
Near-term scarcity remains supportive, but the durability test shifts toward the 2028–2029 capacity wave.
AI workloads, model roadmaps and infrastructure expansion.
Capacity, lead times, materials, packaging and qualification.
Pricing, utilization, inventory and new capacity additions.
Guidance, customer evidence, order flow and capital spending.
Published VIUS research that changed or sharpened the tracker.
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